Copper Heat Sink Manufacturers & Suppliers
What is Copper Heat Sink
A Copper Heat Sink is a passive cooling device leveraging copper’s exceptional thermal conductivity (≥400 W/m·K). It rapidly transfers heat from high-power components to finned surfaces for dissipation via air convection or forced airflow. Designed for extreme heat flux scenarios (>200W/cm²), it is critical in AI server GPUs, 5G RF modules, and HPC systems.
1️⃣ Ultra-Conductive: 2x higher thermal conductivity than aluminum (400 vs. 200 W/m·K)
2️⃣ High-Temperature Stability: Operates up to 300℃ (anodized copper) for aerospace applications
3️⃣ Space-Efficient: 40% smaller than aluminum equivalents at equal cooling capacity
4️⃣ Corrosion Resistance: Ni/Au plating passes MIL-STD-810H salt spray testing
5️⃣ Decade Durability: <5% performance loss after 10-year cyclic usage
Featured
Our advantages
- Small batch agile delivery: rapid delivery of prototypes, support for complex special-shaped structures (such as 3D curved fins)
- Cost-controlled solution: optional copper-aluminum composite process, balance performance and cost (price is 20-35% lower than pure copper solution)
- Customized solutions can be provided in terms of size, shape, functional integration, etc. according to customer needs to meet the personalized heat dissipation needs of different equipment.
CUSTOMIZATION OPTIONS
| Parameters | Options | Technical Notes |
|---|---|---|
| Material | C110 OFC/C194 Alloy/Ni-plated Cu | Thermal conductivity 400-450 W/m·K |
| Manufacturing | CNC/Forging/3D Printing (Cu SLM) | Forged density ≥8.9g/cm³, porosity <0.01% |
| Fin Design | Pin-fin/Skived/Turbine/Bio-honeycomb | 5-15mm height for airflow (ΔP<50Pa) |
| Coating | Electroless Ni/Anti-oxidation/Laser | Ni layer 5-20μm, salt spray >1000hrs |
| Add-ons | Heat pipes/TEC/Temp sensors | Compatible with PID control systems |