Copyright © 2025 Heatsinkpro All Rights Reserved.
The world's leading thermal solution provider
●15 years of precision heat dissipation technology
●1000+ industry success cases
●ISO 9001 & IATF 16949 certification
Why Choose Us
We are committed to providing global customers with cost-effective, fast-response, and flexible customized cooling solutions. With the mission of “making every device run efficiently”, we have been focusing on the heat sink field for more than 10 years, serving multiple fields including consumer electronics, home appliances, industrial equipment, and new energy, and our products are exported to more than 30 countries and regions.
Our Service
A high-density fin structure created by precision cutting metal sheets, ideal for natural convection applications.
Cost-effective aluminum alloy profiles formed through extrusion molding, widely used in electronics cooling.
Zinc/aluminum alloy components with complex geometries produced by high-pressure die casting.
CNC-milled metal blocks providing precise dimensional control for specialized thermal requirements.
Phase-change enhanced cooling systems combining heat pipes with fins for high-efficiency heat transfer.
Durable thermally conductive components formed under high pressure, suitable for harsh environments.
Hydraulic cooling devices with embedded microchannels for direct contact liquid cooling.
Low-cost, mass-produced cooling solution with thin folded fins formed by high-speed stamping, suitable for forced convection systems.
Ultra-flat two-phase heat spreaders using vacuum-sealed chambers for space-constrained applications.
Capability
| No. | Customization Option | Technical Description & Competitive Advantages |
|---|---|---|
| 1 | Fin Height/Base Adjust | ±0.1mm precision tuning for thermal-space optimization (e.g., 30% heat spread gain @11mm base) ★ |
| 2 | Base Resizing | Wire-EDM cutting (±0.05mm), supports miniaturization (10×10mm min) with zero fin deformation |
| 3 | Selective Fin Removal | Laser ablation with ≥95% retention rate, optional reinforcement for <5% stiffness loss ★ |
| 4 | Stepped Fin Cutting | 5-axis multi-level profiling (0.5mm step), 15-20% airflow resistance reduction |
| 5 | FSW Joining | Zero-distortion bonding for 2m modules in 72hrs, Al/Cu hybrid welding (ITR<0.05℃·cm²/W) ★ |
| 6 | Shape Machining | Nano-finishing (Ra 0.2μm) + deep cavities (35:1 aspect ratio) in single process chain |
| 7 | Drilling/Tapping | Micro-drill array (0.3mm±0.01mm), <1.6μm hole roughness, M1.2-M12 thread compatibility |
| 8 | Embedded Copper Base | Vacuum-diffused Cu/Al hybrid (380W/m·K), 43% cost saving vs pure Cu, localized column arrays ★ |
| 9 | Pre-Applied TIM | 10μm-coating uniformity (PCM/graphene), peel-off film design, ICTR<0.1℃·cm²/W ★ |
| 10 | Dynamic Assembly | Self-adaptive spring load (1N-50N±2%) + Z-clip floating compensation (±1.5mm) for PCB warpage |
Material
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